Tracked shipping to Austria with premium packaging for just 3,99 € 

Ship to
Austria
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada benefiting from thermal and mechanical simulation in micro-electronics
Type
Physical Book
Illustrated by
Publisher
Author
Year
2010
Language
English
Pages
192
Format
Paperback
Dimensions
23.4 x 15.6 x 1.1 cm
Weight
0.30 kg.
ISBN
1441948732
ISBN13
9781441948731
Categories

benefiting from thermal and mechanical simulation in micro-electronics

G. Q. Zhang (Illustrated by) · L. J. Ernst (Illustrated by) · O. De Saint Leger (Illustrated by) · Springer · Paperback

benefiting from thermal and mechanical simulation in micro-electronics - Zhang, G. Q. ; Ernst, L. J. ; De Saint Leger, O.

Cheaper New Book Imported to Austria
Delivery: 11 Aug - 18 Aug Shipping: 12 to 16 business days.
100,26 €
Faster New Book Imported to Austria
Delivery: 30 Jul - 03 Aug Shipping: 4 to 5 business days.
137,41 €
Import costs and 10% VAT included in the price ✅
100,26 €

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "benefiting from thermal and mechanical simulation in micro-electronics"

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are: - The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation /LIST Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews