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portada Tsv 3d rf Integration: High Resistivity si Interposer Technology
Type
Physical Book
Publisher
Author
Language
English
Pages
292
Format
Paperback
ISBN13
9780323996020
Edition No.
1

Tsv 3d rf Integration: High Resistivity si Interposer Technology

Shenglin Ma; Yufeng Jin (Author) · Elsevier · Paperback

Tsv 3d rf Integration: High Resistivity si Interposer Technology - Shenglin Ma; Yufeng Jin

New Book Imported to Austria
Delivery: 16 Oct - 20 Oct Shipping: 6 to 7 business days.
382,01 €
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382,01 €

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Synopsis "Tsv 3d rf Integration: High Resistivity si Interposer Technology"

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

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