Name: Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers pt. 1
SKU: 3416165
Price: 383.32 EUR
Availability: InStock
Author: Klopfenstein,Rymaszewski,Tummala
ISBN: 9780412084416

portada Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers pt. 1

Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers pt. 1

Type

Physical Book

Publisher

Springer

Author

Klopfenstein,Rymaszewski,Tummala

Year

1997

Language

English

Pages

1072

Format

Hardcover

ISBN

0412084414

ISBN13

9780412084416

Synopsis "Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers pt. 1 "

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

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Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers pt. 1 - Klopfenstein,Rymaszewski,Tummala

Synopsis "Microelectronics Packaging Handbook: Semiconductor Packaging: Technology Drivers pt. 1 "

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