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portada Adhesion in Microelectronics
Type
Physical Book
Language
English
Pages
368
Format
Hardcover
Dimensions
23.6 x 15.5 x 2.5 cm
Weight
0.64 kg.
ISBN13
9781118831335

Adhesion in Microelectronics

K. L. Mittal (Author) · Tanweer Ahsan (Author) · Wiley-Scrivener · Hardcover

Adhesion in Microelectronics - Mittal, K. L. ; Ahsan, Tanweer

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Synopsis "Adhesion in Microelectronics"

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

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The book is written in English.
The binding of this edition is Hardcover.

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